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CATEGORIES

MG ADHESIVE - THERMAL CONDUCTIVE EPOXY, MEDIUM CURE (RATIO 1:1)

MG ADHESIVE - THERMAL CONDUCTIVE EPOXY, MEDIUM CURE (RATIO 1:1)

Product code : 8329TCM-50ML

82.86 $

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RP Electronics
Sherbrooke, QC
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Lévis, QC
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Multiple of : 1 Minimum buying limit : 1
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Description

Thermal adhesive, high TC. This heat sink adhesive paste is a 2 part 1-1 epoxy system. It is a smooth, dark gray paste that hardens to form a hard, durable, heat-conducting polymer. It provides strong electrical insulation and excellent protection against humidity, salt water, mild bases and aliphatic hydrocarbons.

Features

Additional information

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Other features

Brand
MG CHEMICALS
Quantity
121g
Packing
2 jar kit

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