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CATEGORIES

MG HEAT TRANSFER COMPOUND - SILICONE

MG HEAT TRANSFER COMPOUND - SILICONE

Product code : 860-150G

34.86 $

1 In stock
RP Electronics
Sherbrooke, QC
1
Lévis, QC
0
Multiple of : 1 Minimum buying limit : 1
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Description

Silicone heat transfer compound. 860 is a CPU heat sink compound. Our thermal paste designed to reduce thermal resistance between irregular metal surfaces. Combined with reasonable thermal conductivity, 860 has a soft consistency and a wide operating temperature range, making it in some cases the best thermal paste for CPU applications.

Features

High thermal conductivity
High dielectric strength
Broad service temperature of -40 to 200 °C (-40 to 392 °F)
Excellent corrosion resistance
Non-bleeding
Non-electrically conductive
Long service life

Additional information

Other features

Brand
MG CHEMICALS
Quantity
150g
Packing
Tube

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