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CATEGORIES

MG HEAT TRANSFER COMPOUND - SILICONE

MG HEAT TRANSFER COMPOUND - SILICONE

Product code : 860-4G

2.71 $

78 In stock
RP Electronics
Sherbrooke, QC
78
Lévis, QC
0
From 1 To 992.71 $
From 100 To 9990.00 $
Multiple of : 0.01 Minimum buying limit : 0.01
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+

Description

860 is a CPU heat sink compound. Our thermal paste designed to reduce thermal resistance between irregular metal surfaces. Combined with reasonable thermal conductivity, 860 has a soft consistency and a wide operating temperature range, making it in some cases the best thermal paste for CPU applications.

Features

High thermal conductivity
High dielectric strength
Broad service temperature of -40 to 200 °C (-40 to 392 °F)
Excellent corrosion resistance
Non-bleeding
Non-electrically conductive
Long service life

Additional information

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Other features

Brand
MG CHEMICALS
Quantity
1.7 mm
Packing
Poached

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